Elements

• It makes the system versatile enough to make precise measurements at many points (incoming stencils, the solder paste process, the component placement process, and the re-flow oven process) throughout the SMT assembly process.
  
  
• It dramatically reduces set-up time by importing CAD files and using this data to automatically generate measurement programs. This capability means efficient metrology in low-volume / high-mix manufacturing environments.
  
  
• It helps improve production metrology practices without increasing the need for dedicated programming / metrology personnel.

Elements is offered as two separate software modules, each targeting a specific measurement need within the electronic assembly process:

Stencils Module: Measure incoming stencils and production stencils (after cleaning) to ensure the dimensional integrity of apertures and to identify blockage.

Solder Paste Module: Measure epoxy glue dot registration and solder paste registration with respect to pads on the PCB, and solder paste volume with CAD-driven measurement.

Elements accounts for shrinkage and provides both a tabular and graphical summary of results suitable for ISO 9000 certification.

Measuring with Elements is simple and accurate. With its point-and-click interface, there is truly No Programming Required!

STEP 1: Import the CAD file.
Stencil files
PCB pad files
Gerber files
DXF files

STEP 2: Start measuring
All features
Random features
Specific PCB areas
Specific feature sizes
Specific stencil areas
Specific aperture sizes

STEP 3: Review the automatically generated results summary and graphic analysis

STEP 4: Use this quantified data to optimize the process and improve yields.