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Summit

Large Area, High Accuracy Dimensional Metrology System

Summit

OGP Summit is designed for components requiring a large work envelope and high accuracy. Based on the same core technologies of optics, high speed linear motors, and high resolution scales used in OGP Pinnacle machines, Summit features a fixed bridge design. Separate X and Y axis motion systems ensure that neither influences the mechanical integrity of the other, while also enabling easy loading and unloading of large parts.

Summit is ideally suited for measurement of large footprint parts, such as PCBs, stencils, flat panel displays, etching sheets and mark patterns, or nested groups of smaller parts. Summit provides very high accuracy and high speed for shop floor process monitoring and quality assurance applications.